Application of Tungsten Copper
1. Tungsten Copper for High-temperature Materials
Tungsten copper alloy in the aerospace used as a missile, rocket engine nozzle vane air rudder, the nose cone, the main requirement is to require high temperature (3000K to 5000K), high temperature airflow flushing capacity, using mainly copper at high temperatures The volatiles formed diaphoretic refrigeration (copper melting point 1083 ° C), to reduce the surface temperature of the copper tungsten, use in high temperature and under extreme conditions.
2 Tungsten Copper Alloy for High-voltage Switchgear Electrical
Tungsten copper alloy material as high-voltage electrical switch electrical contacts in the vacuum switch electrical has been widely used in the tungsten copper products account for a large share. And because tungsten copper materials excellent conductivity and resistance to erosion resistance, now used in the new high-voltage electrical switches in SF for the interrupter media. Same time, around the 1980s, and the other newly developed vacuum switch with tungsten copper materials in large wide lower than widely used in 3jkV in, high-voltage electrical appliances, such vacuum electrical switch small size, good performance has become dominant in (6 ~ 35 kV) high-voltage grid and electrification of railway switch, easy to operate, easy to maintain, long life, and have to adapt to the excellent characteristics of flammable, explosive, alpine, wet and corrosive environments use appliances. Vacuum copper tungsten contact material in addition to the required performance with conventional electrical contacts, special requirements should be consistent with the vacuum application materials with extremely low gas content requirements, it requires the use of special technology, such as high temperature or vacuum degassing, vacuum melting infiltration prepared.
3. Electric machining electrodes
The electric machining electrodes is characterized by many different specifications, small-batch, more than the total amount. Electric machining electrodes within the beginning of a longer period in the development of EDM with tungsten copper alloy, commonly used as machining electrodes of copper and copper alloy. With the increasing precision molds and components usage of many difficult-to-machine materials, as well as the EDM process has become more sophisticated, tungsten copper material as EDM electrode amount increasing. Tungsten copper electrical machining electrode material, not only to improve the accuracy of the machining molds and parts, and electrode loss, high processing efficiency, even roughing and finishing of the product once completed. EDM electrode is characterized by many different specifications, and small batch total. As electrical machining electrode tungsten copper material should have a density as high as possible and the uniformity of the organization, particularly some elongated rod, pipe material, and a profiled electrode, if using a conventional method of preparation, the process is very complicated, the material utilization is low.
4. Tungsten Copper Alloy for Microelectronic Materials
Copper tungsten electronic package and the heat sink material, both having a tungsten low expansion characteristics, also has a copper of high thermal conductivity characteristics, its thermal expansion coefficient and thermal conductivity of the conductive properties may be by adjusting the tungsten and copper components and be changed, and thus to the tungsten and copper provide a more wide range of applications. Since the copper tungsten material has a high heat resistance and good thermal conductivity, and also coefficient of thermal expansion match with silicon, GaAs, and ceramics, and therefore widely used in the semiconductor material. Tungsten copper alloy are suitable for high-power device packaging materials, heat sink material, cooling components, ceramic and gallium arsenide base.
Electronic packaging and heat sink with the two-phase composite of tungsten-copper composite material tungsten copper having a high thermal conductivity and low thermal expansion coefficient, and is regarded as a good heat sink material in high-power devices. In recent years, at home and abroad have many experts and scholars on tungsten and copper as a heat sink material, a large number of researches. These studies mainly include powders modified to add the active agent in order to improve the sintered density of the tungsten and copper. With the development of high-power and large-scale integrated circuit of the electronic device, the proposed requirements of the corresponding material upgrading, since the tungsten-copper composite material has both a high heat resistance and good thermal conductivity, and also having a silicon sheet, gallium arsenide, and the ceramic material to match the coefficient of thermal expansion, so as embedded blocks, connecting member and the radiating element has been rapidly applied, now have become an important new electronic package and the heat sink material. Currently, tungsten copper relative density of the material up to 99 or more, the use of high purity powder raw material, the thermal conductivity of the material W a 15Cu rate of up to 200W / (m • K). As electronic packaging and heat sink materials, quality and performance of tungsten copper materials have higher requirements, requires not only a high purity and uniform should be organized, the leak rate is low, good thermal conductivity and thermal expansion coefficient is small, it is subject to strict control of the production process and product quality.
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