Tungsten Copper Microelectronic Material

Tungsten copper microelectronic material has high conductivity and heat resistance, which can remarkably improve the power of microelectronic; it can achieve net size molding and is beneficial for miniaturization; it can change the performance by adjusting the content of W and Cu; it is suitable for high-power device packaging materials, heat sink materials, thermal components, ceramics and gallium arsenide base, etc., to avoid thermal stress caused by thermal fatigue damage; tungsten copper heat sink can be used in: 1. RF, microwave and millimeter-wave; 2. Power packaging; 3. Laser diode; 4. Complex optoelectronic device slides.

The major performance of tungsten copper heat sink:

Grade

TC (W/m·k)

CTE (10-6/K)

Density (g/cm3)

WCu

140~210

5.6~8.3

15~17

WCu10

140~170

5.6~6.5

17.0

WCu15

160~190

6.3~7.3

16.4

WCu20

180~210

7.6~9.1

15.6

tungsten copper picture

Any feendback or inquiry of Tungsten Copper Alloy Products please feel free to contact us:
Email: sales@chinatungsten.com
Tel.: +86 592 512 9696 ; +86 592 512 9595
Fax.: +86 592 512 9797

More Info:  Tungsten Copper   Tungsten Copper Alloy