Tungsten Copper Microelectronic Material
Tungsten copper microelectronic material has high conductivity and heat resistance, which can remarkably improve the power of microelectronic; it can achieve net size molding and is beneficial for miniaturization; it can change the performance by adjusting the content of W and Cu; it is suitable for high-power device packaging materials, heat sink materials, thermal components, ceramics and gallium arsenide base, etc., to avoid thermal stress caused by thermal fatigue damage; tungsten copper heat sink can be used in: 1. RF, microwave and millimeter-wave; 2. Power packaging; 3. Laser diode; 4. Complex optoelectronic device slides.
The major performance of tungsten copper heat sink:
Grade |
TC (W/m·k) |
CTE (10-6/K) |
Density (g/cm3) |
WCu |
140~210 |
5.6~8.3 |
15~17 |
WCu10 |
140~170 |
5.6~6.5 |
17.0 |
WCu15 |
160~190 |
6.3~7.3 |
16.4 |
WCu20 |
180~210 |
7.6~9.1 |
15.6 |
Any feedback or inquiry of Tungsten Copper Alloy Products please feel free to contact us:
Email: sales@chinatungsten.com
Tel.: +86 592 512 9696 ; +86 592 512 9595