Tungsten Copper Submount

What is Tungsten Copper Submount

Tungsten copper submount is a composite of tungsten and copper. The coefficient of thermal expansion (CTE) of the composite can be designed by controlling the content of tungsten, matching that of the materials, such as Ceramics (Al2O3, BeO), Semiconductors (Si), Metals (Kovar), etc. The products are widely applicated in the fields such as radio frequency, microwave, high power diode packaging and optical communication system.

Tungsten Copper Submount Features

High thermal conductivity
Excellent hermeticity
Excellent size control, surface finish and flatness
Semi-finished or finished (Ni/Au plated) products available

tungsten copper submount tungsten copper submount

Tungsten Copper Submount General Grade

Type Composition Properties
  Element Content wt% Density CTE ppm/K TC, W/m·K
Mass density, g/cm3 Relative density, %T.D
W90Cu WCu 90±1balance 17.0 ≥99 5.6~6.5 180~190
W85Cu WCu 85±1balance 16.3 ≥99 6.3~7.0 190~200
W80Cu WCu 80±1balance 15.4 ≥99 7.6~9.1 200~220

Any feedback or inquiry of Tungsten Copper Alloy Products please feel free to contact us:
Email: sales@chinatungsten.com
Tel.: +86 592 512 9696 ; +86 592 512 9595
Fax.: +86 592 512 9797

More Info:  Tungsten Copper   Tungsten Copper Alloy