Tungsten Copper Heat Sink
1. What's Tungsten Copper Heat Sink?
Tungsten copper heat sink is heat-dissipation base and packaging component made of tungsten-copper composite material, combining high melting point and low coefficient of thermal expansion of tungsten with high thermal conductivity of copper. CTIA's tungsten copper heat sink can adjust tungsten-copper ratio so that its coefficient of thermal expansion matches semiconductor chips, ceramic substrates (such as AlN, Al₂O₃) and metal bases, while providing efficient heat-transfer rate. It is widely used in applications requiring high heat-dissipation efficiency and high reliability.
2. Features of CTIA's Tungsten Copper Heat Sink
(1) Low Coefficient of Thermal Expansion: Coefficient of thermal expansion can be controlled within 6.5–9.5×10⁻⁶/K, matching silicon, gallium arsenide, alumina and similar materials, effectively reducing thermal stress.
(2) High Thermal Conductivity: Thermal conductivity typically ranges from 180 to 220 W/(m·K), rapidly extracting heat from chip and lowering operating temperature.
(3) High Mechanical Strength: Tungsten skeleton provides high rigidity and strength, resisting deformation at elevated temperature and delivering good long-term reliability.
(4) Precision Machining Capability: Supports cutting, grinding, drilling and special-shaped machining to meet different structural heat-dissipation requirements.
(5) Flexible Surface Treatment: Nickel plating, gold plating and other treatments can be applied to improve soldering performance and corrosion resistance.
(6) Adjustable Composition: Common grades such as CuW80, CuW85 and CuW90 can be flexibly selected according to heat-conduction and thermal-matching requirements.
3. Applications of CTIA's Tungsten Copper Heat Sink
(1) Lasers: Used in laser diodes and fiber lasers, helping control chip temperature and maintain output stability.
(2) Radio-frequency and Microwave Communication: Used in communication base-station power amplifiers and radar transmitter modules, meeting heat-dissipation requirements of high-power devices.
(3) Power Electronics: Used in Insulated-Gate Bipolar Transistor (IGBT), Silicon Carbide (SiC) and Gallium Nitride (GaN) power modules, balancing heat dissipation with thermal-expansion matching.
(4) Optical Communication: Used as heat sink and heat-dissipation substrate for high-speed optical modules and optical transceivers, helping maintain device operating stability.
(5) Aerospace and Military: Used as heat-dissipation components in airborne, spaceborne electronic assemblies and high-reliability equipment, meeting thermal-management requirements under harsh environments.
4. Specifications of CTIA's Tungsten Copper Heat Sink
(1) Common Material: CuW80, CuW85, CuW90, etc.
(2) Product Form: Sheet, block and special-shaped heat sinks, customizable
(3) Dimension: Thickness 0.5–10 mm, customized according to customer requirement.
(4) Surface Treatment: Nickel plating, gold plating, etc.
CTIA GROUP has been specializing in tungsten-copper alloy sector for nearly 30 years and possesses extensive experience in powder metallurgy and precision machining. CTIA provides material selection, structural design, dimensional customization and precision-machining services for tungsten copper heat sink according to thermal load, coefficient-of-thermal-expansion matching and installation-dimension requirements.
For any inquiry, please contact tungsten copper manufacturer: CTIA GROUP
Email: sales@chinatungsten.com
Tel: 0086 592 5129696 / 0086 592 5129595
Website: tungsten-copper.com
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