Tungsten Copper Heat Sink Packaging Plate
1. What's Tungsten Copper Heat Sink Packaging Plate?
Tungsten copper heat sink packaging plate is tungsten-copper composite sheet produced by powder-metallurgy infiltration process, mainly used for thermal management and packaging of high-power electronic devices. CTIA's tungsten copper heat sink packaging plate uses tungsten to provide low coefficient of thermal expansion and high strength, and copper to provide high thermal conductivity. The material thus combines thermal-expansion characteristics matching those of Silicon (Si), Gallium Arsenide (GaAs), Alumina (Al₂O₃) and other chips or ceramic substrates, while efficiently conducting heat. It is widely applied in heat-dissipation packaging of microwave, radio-frequency, laser, optical-communication and high-power semiconductor devices.
2. Features of CTIA's Tungsten Copper Heat Sink Packaging Plate
(1) Low Thermal Expansion Coefficient and Good Compatibility: The thermal expansion coefficient can be controlled between 6.5 and 9.5 × 10⁻⁶/K (20–100°C), making it compatible with materials such as Si, GaAs, and Al₂O₃, which effectively reduces the risk of thermal stress and thermal fatigue.
(2) Excellent Thermal Conductivity and Rapid Heat Dissipation: Thermal conductivity typically ranges from 180 to 220 W/(m·K), enabling rapid dissipation of heat generated by the chip and significantly reducing junction temperature.
(3) Good Electrical Conductivity, Suitable for Packaging: The copper phase ensures a certain level of electrical conductivity, making it suitable for packaging structures requiring electrical connections or grounding.
(4) High Strength and Dimensional Stability: The tungsten matrix provides high mechanical strength and stiffness, resists deformation at high temperatures, and ensures reliable packaging.
(5) Precision Machining and Surface Treatment Capabilities: Supports grinding, cutting, and drilling, as well as post-processing such as nickel plating and gold plating, meeting the requirements for precision packaging and soldering.
(6) Flexible Composition and Adjustable Performance: Commonly used high-tungsten compositions include CuW85 (CTE approximately 7.0–7.5 × 10⁻⁶/K) and CuW90 (CTE approximately 6.5–7.0 × 10⁻⁶/K), which can be adjusted based on thermal matching and thermal conductivity requirements.
3. Applications of CTIA's Tungsten Copper Heat Sink Packaging Plate
(1) Microwave & RF Devices: Used as heat-sink substrate for power amplifiers, Monolithic Microwave Integrated Circuits (MMIC) and Radio-Frequency (RF) modules, effectively controlling temperature rise and improving device stability.
(2) Laser & Optoelectronic Devices: Used in heat-dissipation packaging of high-power laser diodes and optical modules, lowering junction temperature and extending device service life.
(3) High-Power Semiconductor Packaging: Used as heat sink for Insulated-Gate Bipolar Transistors (IGBT), Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFET), Gallium Nitride (GaN) and Silicon Carbide (SiC) power devices, balancing high heat dissipation with low thermal stress.
(4) Optical Communication & High-Speed Optical Modules: Used as heat sink and packaging substrate for 400G/800G and other high-speed optical modules, ensuring photoelectric conversion efficiency and signal stability.
(5) LED & Photoelectric Devices: Used as packaging substrate for high-power Light-Emitting Diodes (LED), improving heat-dissipation efficiency and reducing luminous decay.
(6) Aerospace & High-Reliability Electronics: Used as heat-dissipation components in aerospace and military electronic equipment, meeting reliability requirements under extreme environments.
4. Specifications of CTIA's Tungsten Copper Heat Sink Packaging Plate
(1) Common Material: W80Cu20, W85Cu15, W90Cu10, etc.
(2) Shape: Square and special-shaped plates
(3) Dimension: Thickness 0.5–5 mm, side length 10–100 mm, customizable
(4) Surface Treatment: Nickel plating, gold plating, etc.
CTIA GROUP has been deeply engaged in tungsten-copper composite for nearly 30 years and possesses extensive experience in powder-metallurgy infiltration and precision machining. CTIA can provide material selection, structural design and customized production services for tungsten copper heat sink packaging plate according to heat-conduction requirements of packaging assembly, thermal-expansion matching requirements between chip and substrate, and structural dimensions.
For any inquiry, please contact tungsten copper manufacturer: CTIA GROUP
Email: sales@chinatungsten.com
Tel: 0086 592 5129696 / 0086 592 5129595
Website: tungsten-copper.com
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