Tungsten Copper alloy Heat Sink
1. What's Tungsten Copper Alloy Heat Sink?
Tungsten copper alloy heat sink is heat-dissipation component made of tungsten-copper pseudo-alloy. It mainly enlarges heat-dissipation area to conduct and dissipate heat generated by electronic devices into surrounding environment or cooling medium. CTIA's tungsten copper alloy heat sink combines low thermal-expansion characteristic of tungsten with high thermal conductivity of copper, and is suitable for high-power electronic devices and thermal-management scenarios requiring thermal-expansion matching.
2. Features of CTIA's Tungsten Copper Alloy Heat Sink
(1) Good Thermal Conductivity, High Heat-Dissipation Efficiency: Copper phase ensures rapid heat conduction. Combined with rational structure, heat can be effectively transferred from device mounting surface to heat-dissipation surface.
(2) Low Coefficient of Thermal Expansion, Dimensional Stability: By adjusting tungsten-copper ratio, thermal matching with chips and ceramic substrates can be improved, reducing interfacial stress caused by temperature change.
(3) High Mechanical Strength, Structural Reliability: Tungsten skeleton raises material rigidity, suitable for heat-dissipation components requiring high assembly accuracy and long-term stability.
(4) Flexible Structure, Strong Adaptability: Flat-plate, thin-sheet, finned, perforated and special-shaped structures can be designed to suit different mounting methods and space constraints.
(5) Convenient Machining, Flexible Connection Methods: Supports cutting, milling, grinding, drilling and nickel plating, facilitating connection with devices or other components.
(6) Adjustable Composition, Easy Selection: Different tungsten-to-copper ratios can be selected based on thermal conductivity requirements, thermal matching, and operating environments, balancing heat dissipation with dimensional stability.
3. Applications of CTIA's Tungsten Copper Alloy Heat Sink
(1) Power Electronics: Used for heat dissipation of Insulated-Gate Bipolar Transistor (IGBT), Silicon Carbide (SiC) power devices and power modules, helping extract heat generated during device operation.
(2) Radio Frequency and Microwave: Used for heat dissipation of communication base-station power amplifiers and radar radio-frequency modules, meeting thermal-management requirements under high-power operation.
(3) Laser Processing and Optoelectronic Equipment: Used for heat dissipation of laser diodes, pump sources and similar devices, controlling operating temperature and maintaining output stability.
(4) Optical Communication: Used for heat dissipation of optical modules, optical transceivers and similar components, reducing impact of temperature variation on device performance.
(5) Aerospace: Used for heat dissipation of satellite communication equipment and airborne electronic assemblies, balancing heat-dissipation demand with dimensional stability under temperature cycling.
4. Specifications of CTIA's Tungsten Copper Alloy Heat Sink
(1) Material Ratio: W70Cu30, W80Cu20, W85Cu15, W90Cu10, etc.
(2) Structural Form: Flat-plate, thin-sheet, finned, perforated and special-shaped structures
(3) Dimension: Customizable
(4) Surface Treatment: Nickel plating, etc.
With nearly 30 years of expertise in tungsten copper alloy manufacturing, CTIA GROUP possesses extensive experience in powder metallurgy and precision machining. Based on heat dissipation area, structural dimensions, contact surfaces, and mounting methods, CTIA provides material selection, structural design, precision machining, and customized solutions for tungsten copper heat sinks.
For any inquiry, please contact tungsten copper manufacturer: CTIA GROUP
Email: sales@chinatungsten.com
Tel: 0086 592 5129696 / 0086 592 5129595
Website: tungsten-copper.com
WeChat:
