Tungsten Copper Alloy in Electronic Packaging and Heat Sink
Tungsten copper alloy, produced via powder metallurgy infiltration, combines a low coefficient of thermal expansion, high strength, and good thermal conductivity, enabling rapid heat conduction while maintaining excellent thermal expansion matching with chips, ceramic substrates, and other materials. CTIA can process tungsten copper alloys into electronic packaging substrate, heat sink, and related components tailored to the heat dissipation requirements and packaging structures of different devices. These are suitable for the packaging and thermal management of high-power semiconductors, microwave/RF devices, lasers, optical communications, and optoelectronic devices.
1. Characteristics of CTIA's Tungsten Copper Alloy in Electronic Packaging and Heat Sink
(1) Low CTE with Good Matching: Coefficient of Thermal Expansion (CTE) can be controlled between 6.5 and 9.5 × 10⁻⁶/K, providing good thermal expansion matching with materials such as silicon, gallium arsenide, and aluminum oxide, thereby reducing interfacial stress caused by temperature changes.
(2) Excellent Thermal Conductivity for Fast Heat Dissipation: Thermal conductivity typically ranges from 180–220 W/(m·K), enabling rapid conduction of heat generated by the chip and helping control device operating temperature.
(3) High Strength and Dimensional Stability: The tungsten skeleton provides high mechanical strength, and the material’s low thermal expansion helps maintain the dimensional stability and connection reliability of the packaged components.
(4) Good Electrical Conductivity for Electrical Connections: The copper phase imparts good electrical conductivity, making the alloy suitable for packaging structures that require both heat conduction and electrical interconnection.
(5) High Machining Precision and Flexible Surface Treatment: Supports precision processes such as grinding, cutting, and drilling, and can be plated with nickel, gold, etc., to meet the dimensional and surface requirements of precision packaging.
(6) Flexible Composition and Adjustable Properties: Common high-tungsten compositions include CuW80, CuW85, and CuW90; the appropriate material can be selected based on requirements for thermal expansion matching, thermal conductivity, and structural strength.
2. Applications of CTIA's Tungsten Copper Alloy in Electronic Packaging and Heat Sink
(1) High-Power Semiconductor Packaging: Used as packaging substrates and heat sinks of IGBT (Insulated-Gate Bipolar Transistor), MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor), SiC (Silicon Carbide), and GaN (Gallium Nitride) power devices, balancing heat dissipation efficiency and thermal expansion matching.
(2) Microwave and RF Devices: Used as heat-sink substrates for power amplifiers and MMIC (Monolithic Microwave Integrated Circuit) modules to help control temperature rise during high-power operation.
(3) Laser and Optical Communication Devices: Used in packaging bases and heat sinks for high-power laser diodes and optical communication modules to improve heat dissipation and reduce the impact of temperature variation on device stability.
(4) LED and Optoelectronic Devices: Used as packaging substrates for LEDs (Light-Emitting Diodes) and heat-dissipation structures for other optoelectronic devices, improving heat transfer efficiency and helping mitigate high-temperature-induced light decay.
(5) Aerospace Electronic Packaging: Used in packaging substrates and heat sinks for high-reliability aerospace electronic equipment, meeting requirements for heat dissipation, thermal expansion matching, and structural stability within limited space.
3. Specifications of CTIA's Tungsten Copper Alloy in Electronic Packaging and Heat Sink
(1) Common Materials: CuW80, CuW85, CuW90, etc.
(2) Product Forms: Tungsten copper sheets, tungsten copper blocks, special-shaped heat sinks, and electronic packaging substrates.
(3) Dimensions and Tolerances: Customizable.
(4) Surface Treatment: Nickel plating, gold plating, etc.
CTIA GROUP has been deeply engaged in tungsten copper alloy for nearly 30 years and possesses extensive experience in powder metallurgy and precision machining. Based on chip materials, heat dissipation needs, thermal expansion matching, and packaging structure, CTIA provides material selection, structural design, and customized processing services for tungsten copper alloys used in electronic packaging and heat sinks.
For any inquiry, please contact tungsten copper manufacturer: CTIA GROUP
Email: sales@chinatungsten.com
Tel: 0086 592 5129696 / 0086 592 5129595
Website: tungsten-copper.com
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