Tungsten Copper Thermal Control Plate
1. What's Tungsten Copper Thermal Control Plate?
Tungsten copper thermal control plate is thermal-management component made of tungsten-copper pseudo-alloy. It can serve as heat-conduction, heat-distribution and structural-support element in liquid-cooling systems, electronic packaging and spacecraft thermal-control systems. CTIA's tungsten copper thermal control plate can balance thermal conductivity, thermal-expansion matching and structural stability by adjusting tungsten-copper ratio, and combine flow-channel, fin and mounting-structure design to meet thermal-management requirements of high-power chips, power electronic modules and aerospace equipment.
2. Features of CTIA's Tungsten Copper Thermal Control Plate
(1) Low Coefficient of Thermal Expansion, Structural Stability: Coefficient of thermal expansion is lower than pure copper, reducing thermo-mechanical deformation caused by temperature change and lowering thermal-mismatch risk with silicon chips and ceramic substrates.
(2) Good Thermal Conductivity, Optimizable Thermal Resistance: Copper phase ensures rapid heat conduction. Combined with flow-channel and cooling-structure design, it balances heat-dissipation efficiency with operational reliability.
(3) Flexible Ratio, Tunable Thermal Expansion: By adjusting tungsten-copper proportion, coefficient of thermal expansion and thermal conductivity can be changed to suit thermal-matching requirements of different chips and substrates.
(4) Designable Internal Structure, Flexible Heat-Flow Distribution: Flow channels, pin fins and other structures can be designed to improve heat-exchange effect of cooling medium and optimize heat distribution in different regions.
(5) Resistance to Temperature Cycling, High Reliability: Lower thermal-expansion characteristics help reduce deformation and interfacial stress caused by repeated temperature rise and fall, suitable for long-term stable operation.
(6) Diverse Machining Forms, Easy Integration: Supports cutting, milling, drilling and special-shaped machining. Can incorporate flow channels, mounting holes and connection interfaces to meet system-integration requirements.
3. Applications of CTIA's Tungsten Copper Thermal Control Plate
(1) Data Center and Chip Liquid Cooling: Used as liquid-cooling cold plate or heat-conducting base for high-power chips such as Graphics Processing Unit (GPU) and high-performance processors, reducing impact of cold-plate deformation on chip reliability.
(2) Spacecraft and Satellite Thermal Control: Used as heat-dissipation base plate for spaceborne radar power modules and satellite communication equipment, adapting to orbital temperature variation and high-reliability requirements.
(3) High-Power Lasers and Optical Communication: Used as thermal-control base for laser diodes, pump sources and high-power optical-communication devices, maintaining stable operating temperature.
(4) Electric Vehicles and Power Electronics: Used as thermal-management substrate for inverters and Insulated-Gate Bipolar Transistor (IGBT) modules, balancing heat dissipation with thermal-expansion matching of ceramic carriers.
(5) High-Power Electronic Equipment: Used as thermal-management structure for high heat-flux-density equipment such as radar transmitter assemblies and radio-frequency power modules.
4. Specifications of CTIA's Tungsten Copper Thermal Control Plate
(1) Material Ratio: W70Cu30, W80Cu20, W85Cu15, W90Cu10, etc.
(2) Product Structure: Flat-plate, flow-channel, pin-fin and special-shaped structures
(3) Dimension: Customizable
(4) Surface Treatment: Nickel plating, gold plating, etc.
CTIA GROUP has been deeply engaged in tungsten-copper alloy for nearly 30 years and possesses mature powder-metallurgy infiltration and precision-machining capability. CTIA can provide material selection, structural design and finished-product machining services for tungsten copper thermal control plate according to system thermal load, cooling method, thermal-expansion matching and mounting structure.
For any inquiry, please contact tungsten copper manufacturer: CTIA GROUP
Email: sales@chinatungsten.com
Tel: 0086 592 5129696 / 0086 592 5129595
Website: tungsten-copper.com
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