Tungsten Copper Substrate in High-Power Device
Tungsten copper substrate in high-power device is electronic packaging substrate made of tungsten-copper pseudo-alloy, mainly used for mounting, heat conduction and packaging connection of high-power semiconductor devices. CTIA's tungsten copper substrate combines low thermal-expansion characteristic of tungsten with good thermal conductivity of copper. While conducting operating heat of devices, it reduces thermal-expansion mismatch among substrate, chip and ceramic insulating substrate, suitable for power-electronic packaging that demands high heat-dissipation efficiency, thermal-cycling reliability and dimensional stability.
1. Features of CTIA's Tungsten Copper Substrate in High-Power Devices
(1) Low Coefficient of Thermal Expansion, Good Matching: By adjusting tungsten-copper ratio, thermal expansion of substrate approaches that of chip or ceramic substrate, reducing interfacial stress caused by temperature change.
(2) Good Thermal Conductivity, Rapid Heat Dissipation: Copper phase rapidly conducts heat from power devices to heat-dissipation structure, adapting to high thermal-load scenarios.
(3) High Mechanical Strength, Structural Stability: Tungsten skeleton raises rigidity, making deformation less likely during assembly and temperature cycling.
(4) High Dimensional Accuracy, Suitable for Precision Packaging: Can be precision-machined according to chip size and packaging structure to meet positioning and connection-surface requirements.
(5) Diverse Surface Treatment, Convenient Connection: Coatings can be selected based on brazing or soldering processes to improve bonding performance with other packaging components.
(6) Adjustable Composition for Flexible Selection: The appropriate tungsten-to-copper ratio can be chosen based on chip material, thermal load, and packaging process to balance thermal conductivity and thermal matching.
2. Applications of CTIA's Tungsten Copper Substrate in High-Power Devices
(1) Power Semiconductor Packaging: Used as packaging substrate for Insulated-Gate Bipolar Transistor (IGBT), Silicon Carbide (SiC) power devices and power modules, conducting operating heat and improving packaging thermal matching.
(2) Electric Vehicles and New-Energy Vehicles: Used in packaging structures of traction inverters, on-board power modules and similar components, adapting to thermal-stress variation from high-power operation and repeated power cycling.
(3) Power Electronic Equipment: Used as packaging substrate for frequency converters, industrial power supplies and power-conversion modules, meeting heat-dissipation and structural-stability requirements of high-power-density devices.
(4) Radio-Frequency and Microwave Devices: Used as packaging substrate for high-power radio-frequency amplifiers, radar transmitter modules and similar devices, balancing heat conduction with chip-packaging matching.
(5) Aerospace Electronic Equipment: Used in packaging structures of high-reliability power modules and related electronic assemblies, meeting dimensional-stability and thermal-management requirements under temperature variation.
3. Specifications of CTIA's Tungsten Copper Substrate in High-Power Devices
(1) Material Ratio: W70Cu30, W80Cu20, W85Cu15, W90Cu10, etc.
(2) Product Form: Flat substrate, thin-sheet substrate, perforated substrate and special-shaped substrate
(3) Dimension: Customizable
(4) Surface Treatment: Nickel plating, gold plating, etc.
With nearly 30 years of specialized experience in tungsten copper alloy, CTIA GROUP possesses extensive expertise in powder metallurgy and precision machining. By taking into account the chip materials, ceramic substrate types, thermal loads, and packaging and bonding processes of power devices, CTIA provides material selection, substrate design, precision machining, and customized solutions for tungsten copper substrates used in high-power devices.
For any inquiry, please contact tungsten copper manufacturer: CTIA GROUP
Email: sales@chinatungsten.com
Tel: 0086 592 5129696 / 0086 592 5129595
Website: tungsten-copper.com
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